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mmc: tmio: split core functionality, DMA and MFD glue

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TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to
the one, used in MN5774 and other MN57xx controllers. These IP cores are
included in many multifunction devices, in sh-mobile chips from Renesas,
in the latter case they can also use DMA. Some sh-mobile implementations
also have some other specialities, that MFD-based solutions don't have.
This makes supporting all these features in a monolithic driver inconveniet
and error-prone. This patch splits the driver into 3 parts: the core,
the MFD glue and the DMA support. In case of a modular build, two modules
will be built: mmc_tmio_core and mmc_tmio.

Signed-off-by: Guennadi Liakhovetski <g.liakhovetski@gmx.de>
Acked-by: Paul Mundt <lethal@linux-sh.org>
Signed-off-by: Chris Ball <cjb@laptop.org>
This commit is contained in:
Guennadi Liakhovetski
2011-03-23 12:42:44 +01:00
committed by Chris Ball
parent 5f52c35529
commit b6147490e6
6 changed files with 1409 additions and 1285 deletions
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drivers/mmc/host/Kconfig
+4
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@@ -439,9 +439,13 @@ config MMC_SDRICOH_CS
To compile this driver as a module, choose M here: the
module will be called sdricoh_cs.
config MMC_TMIO_CORE
tristate
config MMC_TMIO
tristate "Toshiba Mobile IO Controller (TMIO) MMC/SD function support"
depends on MFD_TMIO || MFD_ASIC3 || MFD_SH_MOBILE_SDHI
select MMC_TMIO_CORE
help
This provides support for the SD/MMC cell found in TC6393XB,
T7L66XB and also HTC ASIC3